首页> 外文期刊>Bulletin of the Korean Chemical Society >Spectroscopic and Morphological Investigation of Copper Oxide Thin Films Prepared by Magnetron Sputtering at Various Oxygen Ratios
【24h】

Spectroscopic and Morphological Investigation of Copper Oxide Thin Films Prepared by Magnetron Sputtering at Various Oxygen Ratios

机译:磁控溅射制备不同氧比氧化铜薄膜的光谱和形貌研究

获取原文
获取外文期刊封面目录资料

摘要

Copper oxide thin films were synthesized by reactive radio frequency magnetron sputtering at different oxygen gas ratios. The chemical and physical properties of the thin films were investigated by X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), atomic force microscopy (AFM), and X-ray diffraction (XRD). XPS results revealed that the dominant oxidation states of Cu were Cu0 and Cu+ at 0% oxygen ratio. When the oxygen ratios increased above 5%, Cu was oxidized as CuO as detected by X-ray induced Auger electron spectroscopy and the Cu(OH)2 phase was confirmed independent of the oxygen ratio. The valence band maxima were 1.19 ± 0.09 eV and an increase in the density of states was confirmed after formation of CuO. The thickness and roughness of copper oxide thin films decreased with increasing oxygen ratio. The crystallinity of the copper oxide films changed from cubic Cu through cubic Cu2O to monoclinic CuO with mean crystallite sizes of 8.8 nm (Cu) and 16.9 nm (CuO) at the 10% oxygen ratio level.
机译:通过反应性射频磁控溅射在不同的氧气比例下合成了氧化铜薄膜。通过X射线光电子能谱(XPS),扫描电子显微镜(SEM),原子力显微镜(AFM)和X射线衍射(XRD)研究了薄膜的化学和物理性质。 XPS结果表明,当氧含量为0%时,Cu的主要氧化态为Cu0和Cu +。当氧比率增加到5%以上时,通过X射线诱导俄歇电子能谱法检测到,Cu被氧化为CuO,并且证实了Cu(OH)2相与氧比率无关。价带最大值为1.19±0.09 eV,并在形成CuO后确认了态密度的增加。氧化铜薄膜的厚度和粗糙度随氧比的增加而减小。在氧含量为10%的情况下,氧化铜膜的结晶度从立方Cu变为立方Cu2O变为单斜晶CuO,平均晶粒尺寸为8.8 nm(Cu)和16.9 nm(CuO)。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号