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Mathematical Calculation and Experimental Investigation of Expanded Perlite Based Heat Insulation Materials’ Thermal Conductivity Values

机译:膨胀珍珠岩绝热材料导热系数数值的数学计算与实验研究

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Thermal resistance can be increased by using proper heat insulation materials. Traditional heat insulation materials do not stand all desired properties. Thus, developing new heat insulation materials is very important. In this study, expanded perlite based heat insulation material was developed as an alternative to the traditional insulation materials. The composition of the developed material was designed and prepared using the theoretical thermal conductivity prediction models. The prepared material was molded in a rectangular shape panel. Thermal conductivities of panels were measured experimentally and the results were compared with the calculated results. Also, the results showed that the developed panels can be used for heat insulation applications. On the other hand, the closest model to the experimental results is the parallel model whose average deviation is 4.22% while the farthest model is the Cheng and Vachon model whose average deviation is 12.43%. It is obtained that parallel and series models are generally in good agreement with the experimental results. Nevertheless, it is seen some deviations between experimental and theoretical calculation results. The theoretical prediction models do not include any processing conditions such as molding and curing. It is thought that these deviations have originated because of the missing processing parameters in theoretical prediction models. As a result of experimental studies, the lo west thermal conductivity value of expanded perlite based panels was obtained 43.5 mW/m.K. Consequently, the heat transfer coefficient of the panels containing expanded perlite can be calculated nearly b y the parallel method.
机译:通过使用适当的隔热材料可以增加热阻。传统的隔热材料不能满足所有期望的性能。因此,开发新型的隔热材料非常重要。在这项研究中,开发了基于膨胀珍珠岩的隔热材料,以替代传统的隔热材料。使用理论热导率预测模型设计和制备了开发材料的成分。将制备的材料模制在矩形面板中。实验测量板的热导率,并将结果与​​计算结果进行比较。此外,结果表明,开发的面板可用于隔热应用。另一方面,最接近实验结果的模型是平行模型,其平均偏差为4.22%,而最远的模型是Cheng和Vachon模型,其平均偏差为12.43%。结果表明,并联模型和串联模型与实验结果基本吻合。尽管如此,实验和理论计算结果之间还是存在一些偏差。理论预测模型不包括任何加工条件,例如模塑和固化。认为这些偏差是由于理论预测模型中缺少处理参数而引起的。作为实验研究的结果,膨胀珍珠岩基板的最低导热系数为43.5 mW / m.K。因此,几乎可以通过并行方法计算出含有膨胀珍珠岩的板的传热系数。

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