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首页> 外文期刊>Journal of nanomaterials >Simple, Fast, and Cost-Effective Fabrication of Wafer-Scale Nanohole Arrays on Silicon for Antireflection
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Simple, Fast, and Cost-Effective Fabrication of Wafer-Scale Nanohole Arrays on Silicon for Antireflection

机译:硅片上晶圆级纳米孔阵列的简单,快速和经济有效的制造,以实现抗反射

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A simple, fast, and cost-effective method was developed in this paper for the high-throughput fabrication of nanohole arrays on silicon (Si), which is utilized for antireflection. Wafer-scale polystyrene (PS) monolayer colloidal crystal was developed as templates by spin-coating method. Metallic shadow mask was prepared by lifting off the oxygen etched PS beads from the deposited chromium film. Nanohole arrays were fabricated by Si dry etching. A series of nanohole arrays were fabricated with the similar diameter but with different depth. It is found that the maximum depth of the Si-hole was determined by the diameter of the Cr-mask. The antireflection ability of these Si-hole arrays was investigated. The results show that the reflection decreases with the depth of the Si-hole. The deepest Si-hole arrays show the best antireflection ability (reflection < 9%) at long wavelengths (>600 nm), which was about 28 percent of the nonpatterned silicon wafer’s reflection. The proposed method has the potential for high-throughput fabrication of patterned Si wafer, and the low reflectivity allows the application of these wafers in crystalline silicon solar cells.
机译:本文开发了一种简单,快速且具有成本效益的方法,用于在硅(Si)上高通量制造纳米孔阵列,并将其用于抗反射。通过旋涂法开发了晶圆级聚苯乙烯(PS)单层胶体晶体作为模板。通过从沉积的铬膜上剥离经氧蚀刻的PS珠来制备金属荫罩。纳米孔阵列通过硅干法刻蚀制造。制备了一系列具有相似直径但深度不同的纳米孔阵列。发现Si孔的最大深度由Cr掩模的直径确定。研究了这些硅孔阵列的抗反射能力。结果表明,反射率随硅孔深度的增加而减小。最深的Si孔阵列在长波长(> 600 nm)上显示出最佳的抗反射能力(反射率<9%),约占未图案化硅片反射率的28%。所提出的方法具有用于图案化的硅晶片的高通量制造的潜力,并且低反射率允许将这些晶片应用于晶体硅太阳能电池中。

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