Thermodynamic analysis and characterization of alloys in Bi-Cu-Sb system

摘要

The results of thermodynamic analysis and characterization of some alloys in Bi-Cu-Sb lead-free solder system are presented in this paper. Thermodynamic analysis was done using general solution model, while optic microscopy, hardness and electroconductivity measurements were used in order to determine structural, mechanic and electric characteristics of selected samples in section from bismuth corner with molar ratio Cu:Sb=3:7.