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Limitations of On-Wafer Calibration and De-Embedding Methods in the Sub-THz Range

机译:亚太赫兹范围内的晶圆上校准和去嵌入方法的局限性

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摘要

This paper investigates frequency limitations of calibration and de-embedding techniques for S parameter measurements. First, the TRL calibration methods are analysed and the error due to the probe movement when measuring the different line lengths is quantified, next the coupling between the probe-heads and the wafer surface is investigated and finally an upper frequency validity limit for the standard Open-Short de-embedding method is given. The measured results have been confirmed thanks to the use of an electro-magnetic simulator.
机译:本文研究了用于S参数测量的校准和去嵌入技术的频率限制。首先,分析TRL校准方法,并量化在测量不同线长时由于探针移动而引起的误差,然后研究探针头与晶片表面之间的耦合,最后确定标准开口的频率有效性上限-给出了短的去嵌入方法。测量结果已经通过使用电磁模拟器得到了证实。

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