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Improving the drain-current expression of BSIM4 for hot-carrier degradation modeling that is suitable for analog applications

机译:改进BSIM4的漏极电流表达式,以进行热载流子退化建模,适用于模拟应用

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摘要

The reliability evaluation of MOS transistors is one of the most important subjects in device engineering and VLSI design. The down-scaling of device dimensions adversely affects device reliability and lifetime. Although different factors contribute to device reliability and lifetime, the most influential factor is hot-carrier degradation. Furthermore, hot-carrier degradation affects each application uniquely. In analog applications, hot-carrier degradation is more complex and diverse relative to digital applications. In this study, we improve the BSIM4 drain-current model to develop a hot-carrier degradation model that is suitable for both analog and digital applications. Our approach is readily applicable to all process technologies because it depends only on the measured data from fresh and degraded devices. The simulation results of four different process technologies are in excellent agreement with the measured data.
机译:MOS晶体管的可靠性评估是器件工程和VLSI设计中最重要的主题之一。减小器件尺寸会不利地影响器件的可靠性和寿命。尽管不同的因素会影响设备的可靠性和使用寿命,但最有影响力的因素是热载流子退化。此外,热载流子降级会独特地影响每个应用程序。在模拟应用中,相对于数字应用,热载波降级更为复杂和多样。在这项研究中,我们改进了BSIM4漏极电流模型,以开发适用于模拟和数字应用的热载流子退化模型。我们的方法很容易适用于所有工艺技术,因为它仅取决于来自新设备和降级设备的测量数据。四种不同工艺技术的仿真结果与实测数据非常吻合。

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