...
首页> 外文期刊>Microelectronics reliability >An analytical model for hot carrier degradation in nanoscale CMOS suitable for the simulation of degradation in analog IC applications
【24h】

An analytical model for hot carrier degradation in nanoscale CMOS suitable for the simulation of degradation in analog IC applications

机译:纳米级CMOS中热载流子退化的分析模型适用于模拟IC应用中的退化

获取原文
获取原文并翻译 | 示例
           

摘要

Channel hot carrier (CHC) degradation is one of the major reliability concerns for nanoscale transistors. To simulate the impact of CHC on analog circuits, a unified analytical model able to cope with various design and process parameters is proposed. In addition, our model can handle initial degradation and varying stress conditions, allowing the designer to estimate the impact of CHC on transistor performance for arbitrary stressing patterns. The model is experimentally verified in a 65 nm CMOS technology. Expressions to simulate the impact of transistor degradation on relevant transistor parameters like output conductance and threshold voltage degradation are presented and verified.
机译:沟道热载流子(CHC)退化是纳米级晶体管的主要可靠性问题之一。为了模拟CHC对模拟电路的影响,提出了一种能够应对各种设计和工艺参数的统一分析模型。此外,我们的模型可以处理初始退化和变化的应力条件,从而使设计人员能够针对任意应力模式估算CHC对晶体管性能的影响。该模型已通过65 nm CMOS技术进行了实验验证。提出并验证了模拟晶体管退化对相关晶体管参数(如输出电导和阈值电压退化)的影响的表达式。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号