Recent advances in nanowire research emphasize on its promising applications in nanoelectronics,nanophotonics, nanomedicine, and nanoelectromechanical systems (NEMS). Even with many advances, the joining ofnanowires has become a critical issue for future device miniaturization and integration. With the help of in situmanipulation, directed assembly and self-assembly, much progress has been made towards joining of nanowires such aswelding, soldering, fastener materials, and controlled localized deposition. These methods provide multiple choices forjoining nanowires of various materials, at the mean time good electrical conductivity and mechanical strength can beachieved. This paper reviewed the state-of-the-art techniques for joining nanowires, and discussed the advantages andlimitations of each method. The process and mechanism of these techniques are described in three categories: nanowirenanowirejoining, nanowire network joining, and nanowire-contact pad/electrode joining.
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