Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components

摘要

Hybrid System-in-Foil exploits the complementary benefits of integrating embedded silicon chips with on-foil passive and active electronic components. In this work, the design, fabrication and characterization of three on-foil components, namely a humidity sensor, near field communication antenna and organic thin-film transistors, are investigated.