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机译:用于HYSIF集成的铝箔传感器和超薄芯片的特征
Inst Mikroelekt Stuttgart IMS CHIPS D-70569 Stuttgart Germany;
Inst Mikroelekt Stuttgart IMS CHIPS D-70569 Stuttgart Germany;
Inst Mikroelekt Stuttgart IMS CHIPS D-70569 Stuttgart Germany;
Inst Mikroelekt Stuttgart IMS CHIPS D-70569 Stuttgart Germany;
Inst Mikroelekt Stuttgart IMS CHIPS D-70569 Stuttgart Germany;
Inst Mikroelekt Stuttgart IMS CHIPS D-70569 Stuttgart Germany;
Inst Mikroelekt Stuttgart IMS CHIPS D-70569 Stuttgart Germany;
Inst Mikroelekt Stuttgart IMS CHIPS D-70569 Stuttgart Germany;
Temperature sensors; Sensor phenomena and characterization; Temperature measurement; Substrates; Resistance; Flexible electronics; flexible packaging; hybrid system-in-foil; humidity sensor; microcontrollers; system-on-package; smart sensor systems; temperature sensor; ultra-thin chips;
机译:超薄传感器系统,将硅芯片与箔上无源和有源组件集成在一起
机译:铝箔混合系统(HySiF)利用超薄柔性芯片
机译:开发用于可穿戴生物医学应用的高灵敏度和超薄硅应力传感器芯片
机译:用于HySiF集成的薄膜温度传感器和超薄芯片的特性
机译:集成和测试期间LSST相机传感器效应的表征
机译:用于微流控芯片的可聚二甲基硅氧烷集成微压传感器
机译:机械柔性超薄硅芯片的光电二极管和图像传感器