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首页> 外文期刊>Proceedings >Nanofabrication of Vertically Aligned 3D GaN Nanowire Arrays with Sub-50 nm Feature Sizes Using Nanosphere Lift-off Lithography
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Nanofabrication of Vertically Aligned 3D GaN Nanowire Arrays with Sub-50 nm Feature Sizes Using Nanosphere Lift-off Lithography

机译:使用纳米球剥离光刻技术对亚微米级50纳米特征尺寸的垂直对准3D GaN纳米线阵列进行纳米加工。

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摘要

Vertically aligned 3D gallium nitride (GaN) nanowire arrays with sub-50 nm feature sizes were fabricated using a nanosphere lift-off lithography (NSLL) technique combined with hybrid top-down etching steps (i.e., inductively coupled plasma dry reactive ion etching (ICP-DRIE) and wet chemical etching). Owing to the well-controlled chemical surface treatment prior to the nanobead deposition and etching process, vertical GaN nanowire arrays with diameter of ~35 nm, pitch of ~350 nm, and aspect ratio of &10 could be realized using 500 nm polystyrene nanobead (PN) masks. This work has demonstrated a feasibility of using NSLL as an alternative for other sophisticated but expensive nanolithography methods to manufacture low-cost but highly ordered 3D GaN nanostructures.
机译:使用纳米球剥离光刻(NSLL)技术结合混合自上而下的蚀刻步骤(即电感耦合等离子体干法反应性离子蚀刻(ICP),制造出具有小于50 nm特征尺寸的垂直对准3D氮化镓(GaN)纳米线阵列-DRIE)和湿法化学蚀刻)。由于在纳米珠沉积和蚀刻工艺之前对化学表面进行了良好控制,因此使用500 nm聚苯乙烯纳米珠可实现直径约为35 nm,间距约为350 nm,纵横比大于10的垂直GaN纳米线阵列(PN)面具。这项工作证明了使用NSLL作为其他复杂但昂贵的纳米光刻方法的替代方法来制造低成本但高度有序的3D GaN纳米结构的可行性。

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