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Effect of polyarylene ether nitrile on the curing behaviors and properties of bisphthalonitrile

机译:聚亚芳基醚腈对双苯甲腈固化行为和性能的影响

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The 2,2-bis[4-(3,4)-dicyanophenoxy phenyl]propane (BAPh)/polyarylene ether nitrile (PEN-OH) prepolymers and polymers were prepared by heat polymerization. Firstly, BAPh/PEN-OH systems were characterized using differential scanning calorimetry, dynamic rheological analysis, and thermal gravimetric analysis. The results revealed that the polymerization reaction can be controlled by various concentrations of PEN-OH and postcuring temperatures, and BAPh/PEN-OH prepolymers had low curing temperatures (229.3–300.4°C), large processing windows (~106.5°C) with low melt viscosities, and excellent thermal stabilities. Then, the polymerization reaction and surface structures of BAPh/PEN-OH systems were investigated using Fourier transform infrared and scanning electron microscopy, respectively. The interpenetrating polymer networks were found in BAPh/PEN-OH polymers, suggesting that the addition of PEN-OH can not only promote the curing behaviors of BAPh but also increase the toughness of the polymers. The flexure strength and modulus of BAPh/PEN-OH polymers increased with the introduction of PEN-OH. The dielectric properties of BAPh/PEN-OH polymers were investigated, which had little dependence on the frequency. BAPh/PEN-OH systems can be used as a good candidate for high-performance polymeric materials.
机译:通过热聚合制备2,2-双[4-(3,4)-二氰基苯氧基苯基]丙烷(BAPh)/聚亚芳基醚腈(PEN-OH)预聚物和聚合物。首先,使用差示扫描量热法,动态流变分析和热重分析法对BAPh / PEN-OH系统进行了表征。结果表明,可以通过不同的PEN-OH浓度和后固化温度来控制聚合反应,BAPh / PEN-OH预聚物的固化温度低(229.3–300.4°C),加工窗口大(〜106.5°C),低熔体粘度和出色的热稳定性。然后,分别用傅里叶变换红外和扫描电子显微镜研究了BAPh / PEN-OH体系的聚合反应和表面结构。在BAPh / PEN-OH聚合物中发现了互穿的聚合物网络,这表明PEN-OH的加入不仅可以促进BAPh的固化行为,而且可以提高聚合物的韧性。 BAPh / PEN-OH聚合物的弯曲强度和模量随PEN-OH的引入而增加。研究了BAPh / PEN-OH聚合物的介电性能,它对频率的依赖性很小。 BAPh / PEN-OH系统可以用作高性能聚合物材料的理想选择。

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