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Fabrication of Si/graphene/Si Double Heterostructures by Semiconductor Wafer Bonding towards Future Applications in Optoelectronics

机译:半导体晶圆键合技术在硅/石墨烯/硅双异质结构的制备中的应用

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摘要

A Si/graphene/Si planar double heterostructure has been fabricated by means of semiconductor wafer bonding. The interfacial mechanical stability and interlayer electrical connection have been verified for the structure. To the best of our knowledge, this is the first realization of a monolayer-cored double heterostructure. In addition, a double heterostructure with bilayer graphene has been prepared for bandgap generation and tuning by application of a bias voltage. These structures move towards the realization of versatile graphene optoelectronics, such as an electrically pumped graphene laser. Our Si/graphene/Si double heterostructure is positioned to form a new basis for next-generation nanophotonic devices with high photon and carrier confinements, earth abundance (C, Si), environmental safety (C, Si), and excellent optical and electrical controllability by silicon clads.
机译:通过半导体晶片键合已经制造了Si /石墨烯/ Si平面双异质结构。已经验证了该结构的界面机械稳定性和层间电连接。据我们所知,这是单层有核双异质结构的首次实现。另外,已经制备了具有双层石墨烯的双异质结构,用于通过施加偏置电压来产生带隙并进行调谐。这些结构趋向于实现通用的石墨烯光电器件,例如电泵浦的石墨烯激光器。我们的Si /石墨烯/ Si双异质结构的定位为具有高光子和载流子限制,地球丰度(C,Si),环境安全(C,Si)以及出色的光电控制性的下一代纳米光子器件奠定了新的基础由硅包层。

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