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Novel High?Holding Voltage SCR with Embedded Carrier Recombination Structure for Latch-up Immune and Robust ESD Protection

机译:具有嵌入式载波复合结构的新型高保持电压SCR,具有闩锁免疫和鲁棒的ESD保护功能

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A novel CMOS-process-compatible high-holding voltage silicon-controlled rectifier (HHV-SCR) for electrostatic discharge (ESD) protection is proposed and demonstrated by simulation and transmission line pulse (TLP) testing. The newly introduced hole (or electron) recombination region H-RR (or E-RR) not only recombines the minority carrier in parasitic PNP (or NPN) transistor base by N+ (or P+) layer, but provides the additional recombination to eliminate the surface avalanche carriers by newly added P+ (or N+) layer in H-RR (or E-RR), which brings about a further improvement of holding voltage ( V ~(h)). Compared with the measured V ~(h)of 1.8 V of low-voltage triggered silicon-controlled rectifier (LVTSCR), the V ~(h)of HHV-SCR can be increased to 8.1 V while maintaining a sufficiently high failure current ( I ~(t2)> 2.6 A). An improvement of over four times in the figure of merit (FOM) is achieved.
机译:提出了一种新型的与CMOS工艺兼容的用于静电放电(ESD)保护的高保持电压可控硅整流器(HHV-SCR),并通过仿真和传输线脉冲(TLP)测试进行了演示。新引入的空穴(或电子)重组区H-RR(或E-RR)不仅通过N +(或P +)层重组寄生PNP(或NPN)晶体管基极中的少数载流子,而且提供了额外的重组以消除通过在H-RR(或E-RR)中新添加的P +(或N +)层形成表面雪崩载流子,从而进一步提高了保持电压(V〜(h))。与低压触发可控硅整流器(LVTSCR)测得的1.8 V的V〜(h)相比,HHV-SCR的V〜(h)可以增加至8.1 V,同时保持足够高的故障电流(I 〜(t2)> 2.6 A)。品质因数(FOM)提高了四倍以上。

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