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首页> 外文期刊>Metals >Diffusion Bonding of Ti 2 AlNb Alloy and High-Nb-Containing TiAl Alloy: Interfacial Microstructure and Mechanical Properties
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Diffusion Bonding of Ti 2 AlNb Alloy and High-Nb-Containing TiAl Alloy: Interfacial Microstructure and Mechanical Properties

机译:Ti 2 AlNb合金与高Nb的TiAl合金的扩散结合:界面组织和力学性能

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In this study, reliable Ti 2 AlNb/high-Nb-containing TiAl alloy (TAN) joints were achieved by diffusion bonding. The effects of bonding temperature and holding time on the interfacial microstructure and mechanical properties were fully investigated. The interfacial structure of joints bonded at various temperatures and holding times was characterized by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). The results show that the typical microstructure of the Ti 2 AlNb substrate/O phase/Al(Nb,Ti) 2 + Ti 3 Al/Ti 3 Al/TAN substrate was obtained at 970 °C for 60 min under a pressure of 5 MPa. The formation of the O phase was earlier than the Al(Nb,Ti) 2 phase when bonding temperature was relatively low. When bonding temperature was high enough, the Al(Nb,Ti) 2 phase appeared earlier than the O phase. With the increase of bonding temperature and holding time, the Al(Nb,Ti) 2 phase decomposed gradually. As the same time, continuous O phase layers became discontinuous and the Ti 3 Al phase coarsened. The maximum bonding strength of 66.1 MPa was achieved at 970 °C for 120 min.
机译:在这项研究中,通过扩散结合获得了可靠的Ti 2 AlNb /高含Nb TiAl合金(TAN)接头。充分研究了键合温度和保持时间对界面微观结构和力学性能的影响。通过扫描电子显微镜(SEM),能量色散谱仪(EDS)和X射线衍射(XRD)表征了在各种温度和保持时间下结合的接头的界面结构。结果表明,Ti 2 AlNb基体/ O相/ Al(Nb,Ti)2 + Ti 3 Al / Ti 3 Al / TAN基体的典型微观结构是在970℃,5 MPa的压力下获得的,历时60分钟。 。当键合温度较低时,O相的形成要早于Al(Nb,Ti)2相。当结合温度足够高时,Al(Nb,Ti)2相出现早于O相。随着键合温度和保持时间的增加,Al(Nb,Ti)2相逐渐分解。同时,连续的O相层变得不连续,并且Ti 3 Al相变粗了。在970°C下保持120分钟的最大粘结强度为66.1 MPa。

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