首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >Microstructure evolution and mechanical properties of diffusion bonding high Nb containing TiAl alloy to Ti2AlNb alloy
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Microstructure evolution and mechanical properties of diffusion bonding high Nb containing TiAl alloy to Ti2AlNb alloy

机译:Ti2alnb合金含有TiAl合金的扩散粘合高NB的微观结构演化与力学性能

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A serious of diffusion bonding (DB) tests between high Nb containing TiAl alloy and Ti2AlNb alloy were conducted and the bonded joints were post-bonded heat treated (PBHT) at 1000 degrees C for 10h. The microstructure observation showed that the thickness and microstructure of the bonding interface were changed with the bonding parameters. The optimized parameter for direct solid-state DB high Nb containing TiAl to Ti2AlNb alloy was obtained as 1000 degrees C-20MPa-90min. PBHT at 1000 degrees C/10h can significantly promote elements diffusion, phase transformation and microstructure evolution in bonding interface. The tensile results showed that PBHT can remarkably improve the tensile strength of TiAl/Ti2AlNb joints. After PBHT, the tensile strength can be increased from 80% to 146% compared with TiAl alloy by changing the failure mode. However, the Al(Nb,Ti)(2) phase in the bonding interface can't eliminated by PBHT in this study. This work provides a strategy not only contributing to control the structure of bonding interface during DB and after PBHT but also improving the properties of TiAl/Ti2AlNb joints.
机译:进行高Nb含有Tial合金和Ti2alnb合金之间的严重扩散键合(DB)试验,并将粘合的接头在1000℃下将粘合的热处理(PBHT)进行后键合10小时。微观结构观察表明,键合界面的厚度和微观结构随键合参数而改变。将含有Tial至Ti2AlNB合金的直接固态DB高NB的优化参数得到1000℃-20MPa-90min。 1000摄氏度的PBHT可以显着促进粘接界面中的元件扩散,相变和微观结构演化。拉伸结果表明,PBHT可以显着提高TiAl / Ti2alnB接头的拉伸强度。在PBHT之后,通过改变故障模式,与Tial合金相比,拉伸强度可以从80%增加到146%。然而,在本研究中,粘合界面中的Al(Nb,Ti)(2)相不能消除PBHT。这项工作不仅提供了一种策略,不仅有助于控制DB期间和PBHT后的粘合界面结构,而且提高了TiAl / Ti2alnb关节的性质。

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