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Transient Liquid Phase Bonding of Semi-Solid Metal 7075 Aluminum Alloy using ZA27 Zinc Alloy Interlayer

机译:使用ZA27锌合金中间层的半固态7075铝合金的瞬态液相键合

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Transient Liquid Phase Bonding (TLPB) process of semi-solid metal 7075 aluminum alloys (SSM7075) using 50 μm thick of ZA27 zinc alloys as interlayers for the experiment were carried out under bonding temperatures of 480 and 540 °C and bonding times of 30, 60, 90 and 120 min respectively. In the bonding zone, the semi-solid state of ZA27 zinc alloy interlayers were diffused into the SSM7075 aluminum alloy. Examination of the bonding zone using Scanning Electron Microscope (SEM) and Energy-dispersive X-ray spectroscopy (EDS) showed that the precipitation of the intermetallic compound of η(Zn–Al–Cu), β(Al 2 Mg 3 Zn 3 ), T′(Zn 10 Al 35 Cu 55 ) and MgZn 2 were formed in the bonding zone. The better homogenized microstructure in the bonding zone was formed when increasing bonding time and bonding temperature. The highest bonding strength was recorded at 17.44 MPa and average hardness was at 87.67 HV with the bonding time of 120 min and temperature at 540 °C. Statistically, the coefficient of determination analysis of bonding strength data was at 99.1%.
机译:半固态金属7075铝合金(SSM7075)的瞬态液相键合(TLPB)工艺使用厚度为50μm的ZA27锌合金作为中间层,在480和540°C的粘结温度和30的粘结时间下进行了实验,分别为60、90和120分钟。在结合区中,ZA27锌合金中间层的半固态扩散到SSM7075铝合金中。使用扫描电子显微镜(SEM)和能量色散X射线光谱仪(EDS)对结合区的检查表明,η(Zn–Al–Cu),β(Al 2 Mg 3 Zn 3)的金属间化合物的沉淀在接合区域中形成了T'(Zn 10 Al 35 Cu 55)和MgZn 2。当增加键合时间和键合温度时,在键合区中形成了更好的均匀组织。记录的最高粘结强度为17.44 MPa,平均硬度为87.67 HV,粘结时间为120分钟,温度为540°C。从统计学上讲,结合强度数据的确定系数分析为99.1%。

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