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Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach

机译:符合标准的压装技术集成到新的背板封装方法中

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摘要

Involving, as it does, DIN and Reversed DIN board connectors, compliant press-fit pins, round cable, flat cable, and coaxial-connectors, the Berg Backpanel System has, over the past two years, gained a recognized position in the European and US markets.Development and expansion of the system in depth, and in breadth, is still ongoing. One of the major subjects is press-fit: preloaded press-fit connectors and studies focused on the relationship between printed circuit board properties vs. compliant press-fit pin design.This paper presents results of these developments and discusses design options.
机译:在过去的两年中,Berg Backpanel System涉及DIN和反向DIN板连接器,兼容的压配合销,圆形电缆,扁平电缆和同轴连接器,在欧洲和欧洲已获得公认的地位。美国市场。该系统在深度和广度上的开发和扩展仍在进行中。压配合是主要主题之一:预装压配合连接器,其研究重点是印刷电路板性能与顺应压配合引脚设计之间的关系。本文介绍了这些发展的结果并讨论了设计方案。

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