首页> 外文期刊>International Journal of Electrochemical Science >Electrodeposition of Tin Based Film on Copper Plate for Electrocatalytic Reduction of Carbon Dioxide to Formate
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Electrodeposition of Tin Based Film on Copper Plate for Electrocatalytic Reduction of Carbon Dioxide to Formate

机译:在铜板上电沉积锡基膜以电催化还原二氧化碳形成甲酸酯

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Sn based film with a thickness of 169 nm has been electrodeposited on copper plate from a cholinechloride/ethylene glycol based electrolyte containing SnCl2. Electrochemical reduction of carbondioxide (CO2) has been studied on the prepared Sn based film electrode in KHCO3 aqueous solution.The electrolysis results show that the faradaic efficiency for producing formate is affected by the timeof the electrode exposed to air and the electrolysis potential. We find that the Sn based film canimprove the electrocatalytic activity for CO2 reduction. The faradaic efficiency for producing formateon the Sn based film electrode (74.1%) is higher than that on the Cu plate electrode.
机译:已经从含有SnCl 2的基于氯化胆碱/乙二醇的电解质中将具有169nm厚度的Sn基膜电沉积在铜板上。研究了制备的锡基薄膜电极在KHCO3水溶液中的二氧化碳(CO2)的电化学还原。电解结果表明,甲酸生成的法拉第效率受电极暴露于空气的时间和电解电位的影响。我们发现,Sn基薄膜可以提高CO2还原的电催化活性。用于生产锡基薄膜电极的法拉第效率(74.1%)高于在铜板电极上的法拉第效率。

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