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首页> 外文期刊>International Journal of Electrochemical Science >Effects of Doped Stannum in the Fabrication of Zinc-Oxide Thin-Film Transistors
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Effects of Doped Stannum in the Fabrication of Zinc-Oxide Thin-Film Transistors

机译:掺杂锡在氧化锌薄膜晶体管制造中的作用

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A sol-gel method was applied with acetates as precursors under standard atmospheric conditions tofabricate ZnO semiconducting thin-films. We evaluated the performances of thin-film transistor (TFT)which has a ZnO active channel layer and the effects of stannum (Sn) doping on the threshold voltageof ZnO TFTs at a low temperature (300 , which was compared with the performances of the un- doped ZnO and stannum-doped zinc oxide (ZTO) TFT. The electrical characteristics of thin-films andTFTs doped with stannum concentrations of 0.3 mole ratio were examined; and reductions at thethreshold voltage of 5.6 V were found. At 300 it was observed that the stannum-doped zinc oxide 2 (ZTO) device has a mobility of 4.2 10 cm /V-s, a threshold voltage of 5.3 V, and an on/off current4 ratio of 10 .
机译:在标准的大气条件下,以乙酸盐为前体,采用溶胶-凝胶法制备了ZnO半导体薄膜。我们评估了具有ZnO有源沟道层的薄膜晶体管(TFT)的性能以及锡(Sn)掺杂对ZnO TFT的阈值电压在低温(300)下的性能的影响,并将其与非ZnO TFT的性能进行了比较。 -掺杂ZnO和掺锡的氧化锌(ZTO)TFT。研究了掺锡浓度为0.3摩尔比的薄膜和TFT的电学特性;发现在5.6 V的阈值电压下有降低的趋势;在300时观察到:掺锡氧化锌2(ZTO)器件的迁移率为4.2 10 cm / Vs,阈值电压为5.3 V,开/关电流比4为10。

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