The Formation and Characterization of Copper Telluride Films from Choline Chloride – Urea Ionic Liquid

摘要

Copper telluride electrodeposition on platinum in ionic liquid media at 60 C is reported. Thebackground electrolyte as solvent ionic liquid consisted in an eutectic mixture of choline chloride andurea (1:2 mole ratio) in which 5-20 mM CuCl and 8 mM TeO2 were dissolved. Cyclic voltammetryand electrochemical impedance spectroscopy using Pt electrode were applied for investigating thecorresponding electrode processes. The electrochemical studies have permitted to interpret thesequence of the Cu metal and CuxTe semiconductor compound depositions and their anodicdissolution. AFM microscopy is also used to determine thickness and roughness of deposited CuxTefilms.