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首页> 外文期刊>International Journal of Electrochemical Science >The Effects of Pulsed Current Parameters on Porosity of Copper Prepared by Jet Electrodeposition
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The Effects of Pulsed Current Parameters on Porosity of Copper Prepared by Jet Electrodeposition

机译:脉冲电流参数对喷射电沉积铜孔隙率的影响

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Surface texturing has become an increasingly prevalent approach to improve the tribological propertiesof materials. The present work aims to study a novel texturing technology. A copper coating with aporous surface structure was directly prepared on stainless steel using a copper sulfate solution bath viahigh-speed jet electrodeposition. A fine, uniform honeycomb structure with micron sized pores can beachieved using a pulsed current. The duty cycle, current density and current frequency of the pulsedcurrent have a notable influence on the microstructure of the deposited surface. Decreasing the dutycycle and increasing the current density can help to achieve a homogeneous and fine porous surface. Themechanism for depositing a porous surface was discussed according to the roles of the current parametersin the formation of the coating microstructure.
机译:表面织构化已成为改善材料摩擦学性能的越来越普遍的方法。本工作旨在研究一种新颖的纹理化技术。使用硫酸铜溶液浴通过高速喷射电沉积在不锈钢上直接制备具有多孔表面结构的铜涂层。可以使用脉冲电流将具有微米级孔的精细,均匀的蜂窝状结构剥离。脉冲电流的占空比,电流密度和电流频率对沉积表面的微观结构有显着影响。减小占空比并增加电流密度可以帮助实现均匀且精细的多孔表面。根据当前参数在涂层微观结构形成中的作用,讨论了沉积多孔表面的机理。

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