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首页> 外文期刊>International Journal of Electrochemical Science >Electroplating Nanostructured Hard Gold through the Pulse Galvanostatic Method
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Electroplating Nanostructured Hard Gold through the Pulse Galvanostatic Method

机译:脉冲恒电流法电镀纳米结构硬金

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摘要

The present work shows a full study of the pulse electroplating of cobalt hard gold on a nickelsubstrate. Certain parameters in the pulse galvanostatic method, including pulse height (currentamplitude), relaxation time (toff), pulse time (ton) and bath temperature, were effectively optimized bythe 渙ne at a time" method to obtain a suitable nanostructured layer. SEM, XRD, EDS, micro-hardnesstesters, roughness measuring instruments and the Auto Lab electrochemical analyzer were utilized instudying the influence of pulse electrodeposition variables on the surface morphology, particles sizes,film composition, mechanical characteristics and electrochemical behaviors of the deposited layer. Theobtained results indicate that under the optimized conditions for pulse electroplating, the pulse height,-2 the toff, the ton, and the bath temperature are 3 mA.cm , 1.5 s, 0.5 s, and 25 C respectively. Theelectroplated surface in the optimum conditions includes a uniform nanostructured layer with lowporosity and fine grains, with an average diameter of 70 nm which has excellent mechanical andelectrochemical properties such as hardness and anticorrosion.
机译:本工作显示了在镍基体上脉冲电镀硬金钴的完整研究。通过“一次”法有效地优化了脉冲恒电流法中的某些参数,包括脉冲高度(电流幅值),弛豫时间(toff),脉冲时间(吨)和熔池温度,以获得合适的纳米结构层。利用XRD,EDS,显微硬度计,粗糙度测量仪和Auto Lab电化学分析仪研究了脉冲电沉积变量对沉积层表面形貌,粒径,膜组成,力学性能和电化学行为的影响。在脉冲电镀的最佳条件下,脉冲高度-2,toff,吨和浴温分别为3 mA.cm,1.5 s,0.5 s和25C。在最佳条件下的电镀表面包括具有低孔隙率和细晶粒的均匀纳米结构层,平均直径为70 nm,具有优异的机械和电化学性能诸如硬度和防腐性能。

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