GOLD ELECTROPLATING METHOD AND HARD GOLD PREPARATION METHOD

摘要

Disclosed in the present invention are a gold electroplating method and a hard gold preparation method. The hard gold preparation method comprises: electroplating a gold layer onto a core shaft formed of material having a low melting point, then forming a hole passing through the electroplated layer to reach the core shaft, and melting the core shaft in order for same to be discharged through the hole; wherein, the method of electroplating the gold layer on the core shaft comprises using the core shaft as a cathode, and implementing electroplating in a cyanide-free electroplating solution containing gold sulphite solution, phosphate, hydrogen phosphate, alkali metal sulphite salt, a hardening agent, and a complexing agent. The gold sulphite solution in the gold layer-forming cyanide-free electroplating solution provided in the present invention has good stability; the gold products obtained by means of the cyanide-free electroplating solution have excellent purity and hardness, and have excellent prospects for industrial application.