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An Improvement of Electrical and Technological Properties in Second Generation Mesfet Devices

机译:第二代Mesfet器件的电气和技术性能的改进

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Since 1961 date of the first integrated circuit to 1971 which has seen the first microprocessor application, the micro-electronics passed from a discrete transistor to MSI integrated circuits with many thousands of integrated components and now to VLSI integrating many hundreds of thousands of devices. Technological recent technological progress permitted the GaAs and its ternary derivative to be the second generation material. So, we present a study on the Gallium arsenide material specifying its transport and electric properties and its specific advantages over the silicon material. A semi insulating substrate study of a gate Schottky diode for the GaAs MESFET devices manufacturing such as structures with and without buffer layer, with buried gate, mushroom and several fingers are carried over. We will study the influence of the input impedance and output resistance to the gate as well as the noise generated by the structures to several fingers.
机译:自从1961年首次使用集成电路以来,一直到1971年出现了微处理器的首次应用,微电子技术已从分立晶体管转移到具有成千上万个集成组件的MSI集成电路,现在又转移到集成了成千上万个设备的VLSI。技术上的最新技术进步使GaAs及其三元衍生物成为第二代材料。因此,我们对砷化镓材料进行了一项研究,详细说明了其传输和电学性质以及与硅材料相比的特定优势。进行了GaAs MESFET器件制造的栅极肖特基二极管的半绝缘衬底研究,该器件例如带有和不带有缓冲层的结构,带有埋入式栅极,蘑菇形和几个指状件的结构。我们将研究输入阻抗和输出电阻对栅极的影响,以及结构对多个手指产生的噪声的影响。

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