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Effect of hydrogen and nitrogen incorporation on the properties of tetrahedral amorphous carbon films grown using S bend filtered cathodic vacuum arc process

机译:氢和氮的掺入对S弯滤阴极真空电弧法生长四面体非晶碳膜性能的影响

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The electrical and mechanical properties of as- grown and also hydrogen and nitrogen incorporated tetrahedral amorphous carbon (ta-C) films, deposited using S bend filtered cathodic vacuum arc process have been reported. First, the effect of varying negative substrate bias on the dark conductivity (? D), activation energy (?E?) and residual stress of as grown ta-C films and next the effect of varying hydrogen and nitrogen partial pressure on the properties of ta-C: H and ta-C: N films deposited at a high negative substrate bias of -300V are reported. The value of ? D is minimum at 10?? ohm ?1cm?1 in as- grown ta-C films deposited at -150V substrate bias whereas the value of ?E? is maximum at 0.22 eV and residual stress is maximum at 0.71 GPa in as- grown ta-C films deposited at -200 V applied substrate bias and it is found to depend on the substrate bias. Hydrogen incorporation in ta-C films decreases the value of ? D to 1.0×10??ohm ?1cm?1, increases the values of ?E? to 0.45 eV continuously with the increase of hydrogen partial pressure up to 1.4×10?3 mbar whereas nitrogen incorporation in ta-C films increases the value of ? D to 10?1 ohm?1cm?1 and decreases the value of ?E? to 0.07 eV continuously with the increase of nitrogen content up to 16.3 at. %. Low amount of hydrogen incorporation in ta-C films up to 7.4×10??mbar hydrogen partial pressure reduces the value of residual stress and larger amount of hydrogen incorporation beyond this pressure increases the value of residual stress whereas nitrogen incorporation in ta-C films reduces the values of residual stress. The effect of hydrogen on ta-C is to give a modest gain in semi-conducting properties by passivating some defect states whereas the effect of nitrogen gives n-type doping effect in ta-C films.
机译:已经报道了使用S弯曲过滤阴极真空电弧工艺沉积的已生长的氢以及氮结合的四面体无定形碳(ta-C)膜的电学和机械性能。首先,变化的负衬底偏压对生长的ta-C薄膜的暗电导率(ΔD),活化能(ΔE2)和残余应力的影响,其次是改变氢和氮分压对d-C薄膜性能的影响据报道在-300V的高负衬底偏压下沉积的ta-C:H和ta-C:N膜。的价值 ? D最小为10 ??在-150V衬底偏压下沉积的ta-C薄膜中,电阻为Ω?1cm?1。在-200 V施加的衬底偏压下沉积的ta-C薄膜中,最大残余应力在0.22 eV时最大,残余应力最大在0.71 GPa时,发现它取决于基底偏压。 ta-C薄膜中的氢掺入会降低δ的值D为1.0×10 10欧姆·Ω·1cm·1,则增大ΔE·的值。氢分压增加到1.4×10?3 mbar时,连续地达到0.45 eV,而ta-C膜中的氮掺入增加了?的值。 D为10Ω·1Ω·1cm·1,并减小Ω·E的值。氮含量增加到16.3 at。时,连续地达到0.07 eV。 %。在ta-C膜中的氢掺入量低至7.4×10-6 mbar氢分压会降低残余应力的值,而在此压力以上的较大量的氢掺入会增加残余应力的值,而在ta-C膜中掺入氮降低残余应力值。氢对ta-C的影响是通过钝化一些缺陷状态来在半导体特性中获得适度的增益,而氮的影响在ta-C膜中给出n型掺杂作用。

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