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Design optimization for capacitive-resistively driven on-chip global interconnect

机译:电容电阻驱动的片上全局互连的设计优化

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References(12) On-chip global wires are speed and power bottleneck in state-of-the-art chips. AC coupling technique is an efficient way to reduce interconnection delay and power. This paper proposes a new capacitive-resistively driven AC coupling global link. Bandwidth performance of the proposed wire is analyzed and an optimization algorithm for capacitive-resistively driven wire is presented. Simulation results show that our optimization methodology can improve the bandwidth. By applying our optimization algorithm, data rate can be improved from 2 Gb/s to 2.5 Gb/s in the implemented transceiver circuit. The proposed optimization algorithm can be applied in high speed global communication.
机译:参考文献(12)片上全局导线是最新型芯片中的速度和功率瓶颈。交流耦合技术是减少互连延迟和功率的有效方法。本文提出了一种新的电容-电阻驱动的交流耦合全局链路。分析了所提出导线的带宽性能,并提出了一种电容-电阻驱动导线的优化算法。仿真结果表明,我们的优化方法可以提高带宽。通过应用我们的优化算法,可以在已实现的收发器电路中将数据速率从2 Gb / s提高到2.5 Gb / s。所提出的优化算法可以应用于高速全球通信。

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