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首页> 外文期刊>Archives of Metallurgy and Materials >Kinetics of Corrosion Process in H2SO4 and HNO3 Aqueous Solutions of Lead Free Sn-Ag-Cu Solder Alloys
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Kinetics of Corrosion Process in H2SO4 and HNO3 Aqueous Solutions of Lead Free Sn-Ag-Cu Solder Alloys

机译:无铅锡银银铜焊料合金中H 2 SO 4 和HNO 3 水溶液的腐蚀过程动力学

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摘要

This paper presents the results of the corrosion resistance of Sn-Ag-Cu alloys in air-saturated aqueous solutions containing NO3-, SO42- ions, whose concentration was equivalent to their contents in acid rains and in concentrations 10 - 100 times higher. The Ag, Cu and Sn concentrations in the corrosive media were determined using the Atomic Absorption Spectrometry. The specific dissolution rate and corrosion current were derived using the a rotating disc technique. The corrosion rate of Sn- Ag-Cu alloys depends on pH of the examined solutions and on the concentration of oxygen near the phase boundary. In the whole range of concentrations of the applied H2SO4 + HNO3 mixtures of acids, the pure Sn was more corrosion resistant than eutectic alloy as well as the near eutectic one, following the sequence: SnSn3.66Ag0.91Cu3.8Ag0.7Cu.
机译:本文介绍了Sn-Ag-Cu合金在含NO3-,SO42-离子的空气饱和水溶液中的耐蚀性结果,其浓度等于酸雨中的含量,且浓度高10-100倍。使用原子吸收光谱法测定腐蚀性介质中的Ag,Cu和Sn浓度。使用旋转盘技术得出比溶解速度和腐蚀电流。 Sn-Ag-Cu合金的腐蚀速率取决于所检查溶液的pH值和相界附近的氧浓度。在所施加的H2SO4 + HNO3混合酸的整个浓度范围内,纯锡比共晶合金和近共晶合金更具耐腐蚀性,其顺序为:Sn> Sn3.66Ag0.91Cu> 3.8Ag0.7Cu 。

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