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Ultra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Array

机译:自由曲面芯片级封装阵列的超高光提取效率和超薄mini-LED解决方案

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In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array.
机译:在这项研究中,我们提出了一种新型封装,即自由形式设计的芯片级封装(FDCSP),它具有超高的光提取效率和蝙蝠翼光场。对于背光应用,主流解决方案是芯片级封装(CSP)和表面贴装器件封装(SMD)。与这两种主流封装相比,CSP,SMD和FDCSP的光提取效率分别为88%,60%和96%。除了超高的光提取效率外,由于具有160度的蝙蝠翼形光场,与CSP和SMD光源阵列相比,FDCSP可以提供更薄,功耗更低的mini-LED解决方案,并且LED数量更少。

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