LIGHT EMITTING DEVICE PACKAGE WHICH IMPROVES LIGHT EXTRACTION EFFICIENCY BY ARRANGING A LIGHT EMITTING DEVICE CHIP ON THE CENTER OF THE PACKAGE

摘要

PURPOSE: A light emitting device package is provided to reduce the installation area of a light emitting diode chip by arranging a Zener diode on a lead frame in which the light emitting diode is arranged.;CONSTITUTION: A first lead frame(210) is located adjacent to a second lead frame(220). A light emitting device chip(230) and a Zener diode(240) are arranged on the first lead frame. A first wire(242) connects the upper surface of the light emitting chip and the second lead frame. A second wire(234) connects the upper surface of the light emitting device chip and the Zener diode. The first wire and the second wire are respectively connected to a pad(235) which is formed on the upper surface of the light emitting device chip.;COPYRIGHT KIPO 2012