Thermal numerical simulation for metal matrix composite design: Application to weight saving in electronic packaging for aeronautics

摘要

This design study aims at replacing aluminium alloy in electronic packaging for aeronautics with a weigh saving objective. In a first time, a classical materials selection method is applied to the problem, showing the most suitable material would be an aluminium alloy reinforced by pitch carbon fibres. In order to define an optimal composite for this application, the thermal dissipation function of the packaging is detailed. An accurate simulation of the heat transfers in the casing was operated thanks to simplified numerical model using finite elements in which the complex geometry of the part has been brought back to a rectangular plate. As a result, the study enhances the interest of anisotropic material, and defines specific directions in which high thermal conductivities are needed.