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An Automatic Technique for Optimizing Reed-Solomon Codes to Improve Fault Tolerance in Memories

机译:优化Reed-Solomon码以提高内存容错性的自动技术

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THE TECHNOLOGICAL EVOLUTION of the IC fabrication process, consisting of device shrinking, power supply reduction, and increasing operating speeds, has significantly reduced the manufacturing yield and reliability of very deep-submicron (VDSM) ICs when various noise sources are present, as recent roadmaps (the International Technology Roadmap for Semiconductors, Medea, and IEEE Design & Test) have demonstrated. As a result, more and more applications must be robust in the presence of multiple faults. Consequently, fault tolerance in storage devices such as high-density and highspeed memories operating at low voltage, is a main concern nowadays and thus the focus of this work.
机译:如最近的发展路线图所示,当存在各种噪声源时,IC制造工艺的技术演进(包括器件缩小,电源减少和运行速度提高)已大大降低了超深亚微米(VDSM)IC的制造良率和可靠性。 (国际半导体技术路线图,Medea和IEEE设计与测试)已进行了演示。结果,在存在多个故障的情况下,越来越多的应用程序必须具有鲁棒性。因此,当今诸如低密度工作的高密度和高速存储器之类的存储设备中的容错能力是当今的主要关注点,因此是这项工作的重点。

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