Heat sink attachment for optimum thermal transfer

摘要

According to industry data, the trend in the heat load per product footprint has grown tenfold for server and communications applications over the past decade - to more than 6,000W/ft~2 in some applications - and it is projected to go even higher. This makes thermal transfer a more crucial aspect of electronics design, writes Southco's Nick Bennett.rnMechanical heat-sink devices, featuring a fin design with a high surface area to footprint ratio, are one method used to transfer heat away from electronic components but the attachment option chosen for their installation could have a significant impact on the efficiency of the thermal management design.