Leak-tight sealing for wafer handling module

摘要

Trelleborg has helped semiconductor process equipment supplier, AP&S torndevelop a leak-tight sealing system for a novel thin wafer carrying system. Thernnew 'Cyclop Sealing' capsule can be added, with only minor modification, tornany semiconductor fabrication line.rnAP&S is a company that develops wet process equipment for the semiconductor industry. One of its more recent developments is the Cyclop Sealing capsule, a one-size-fits-all media tight carrying system that solves a number of problems associated with the processing of thin wafers.