Effect of Annealing on the Structure and the Hardness of Cu/Ni-P Multilayers Produced by Electrodeposition

摘要

Cu/Ni-P multilayers of 10μm thickness, consisting of pure Cu sublayers and Ni-P sublayers of which thicknesses are 50, 100, and 200 nm, have been prepared on Cu substrates by electrodeposition from a single bath by using modulated (i.e. periodic pulse control) current density. Change in hardness of the multilayers with annealing temperature ranging between 473K and 873K has been examined and discussed in relation to the concomitant structural change.