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An Embedded Microprocessor Radiation Hardened by Microarchitecture and Circuits

机译:通过微架构和电路强化的嵌入式微处理器辐射

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摘要

A radiation hardened by design embedded microprocessor is presented. The design uses multiple approaches to minimize the performance reduction from hardening, while simultaneously limiting the power increase. The speculative portions of the pipeline are protected by microarchitecture approaches, i.e., the speculative pipeline is dual redundant, whereby instructions that have errors in one copy cause a pipeline restart—only matching results commit to architectural state. The register file is dual redundant with mechanisms for correction using one copy whose parity is correct. The data cache memory is write-through, allowing protection with parity. The remaining architectural state is protected via hardened circuits. These are implemented with self-correcting triple mode redundant (TMR) flip-flops and TMR logic. The design, implemented here on a 90-nm bulk CMOS process, achieves unprecedented single event effects hardness and 400+ MHz operating frequency at less than 500 mW power consumption. The main constituent circuit hardening approaches have been fabricated and tested separately. Broad beam testing of the constituent circuits has resulted in no uncorrectable soft errors below 100 MeV-cm2mg LET. We describe the CAD flows used to ensure node separation to achieve high immunity to multiple node charge collection and discuss the relative costs of the chosen hardening techniques.
机译:提出了一种经过设计加固的嵌入式微处理器辐射。该设计使用多种方法来最大程度地减少硬化带来的性能下降,同时限制功率的增加。流水线的推测部分受到微体系结构方法的保护,即推测流水线是双重冗余的,因此在一个副本中有错误的指令会导致流水线重新启动,只有匹配的结果才会提交到体系结构状态。寄存器文件是双重冗余的,具有使用奇偶校验正确的一个副本进行校正的机制。数据高速缓存存储器是直写式的,可通过奇偶校验进行保护。剩余的架构状态通过硬化电路得到保护。这些都是通过自校正三模式冗余(TMR)触发器和TMR逻辑实现的。该设计在90 nm体CMOS工艺上实现,在不到500 mW的功耗下实现了前所未有的单事件效应硬度和400+ MHz工作频率。主要组成电路的加固方法已分别制造和测试。组成电路的宽波束测试未导致低于100 MeV-cm2mg LET的不可校正的软错误。我们描述了用于确保节点分离以实现对多个节点电荷收集的高度抗扰性的CAD流程,并讨论了所选强化技术的相对成本。

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