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Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor

机译:可重配置的五层三维集成式逻辑合成孔径雷达处理器

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In this study, the authors present a floating-point synthetic aperture radar processor that achieves a power efficiency of 18.0 mW/GFlop in simulation through the use of three-dimensional (3D) integration and reconfiguration of the data path. The reconfiguration reduces the number of arithmetic units required in every processing element (PE) from 24 down to 10. The processor uses a 3D integrated memory that reduces the memory power consumption by 70% when compared to a 2D memory. The system processes a SAR image using a two-tier 3D integrated PE, which when compared to an equivalent 2D PE decreases the power consumed in the interconnect of each PE by 15.5% and the footprint by 49.2%, and allows the PE to operate 7.1% faster in simulation. Additionally, by using 3D integration in the memory one can reduce the power consumption of the memory by 70%. Furthermore, the authors show how the 3D aspects of the processor can be realised by using 2D tools, when used in conjunction with the proposed through-silicon via assignment algorithm
机译:在这项研究中,作者提出了一种浮点合成孔径雷达处理器,通过使用三维(3D)集成和数据路径重新配置,可以在仿真中实现18.0 mW / GFlop的功率效率。重新配置将每个处理元件(PE)中所需的算术单元数量从24个减少到10个。该处理器使用3D集成内存,与2D内存相比,它可以将内存功耗降低70%。该系统使用两层3D集成式PE处理SAR图像,与等效的2D PE相比,它可将每个PE互连中的功耗降低15.5%,占位面积降低49.2%,并使PE运行7.1模拟速度提高%。此外,通过在内存中使用3D集成,可以将内存的功耗降低70%。此外,作者展示了当与拟议的贯穿硅通过分配算法结合使用时,如何通过使用2D工具来实现处理器的3D方面。

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