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Disbond growth detection in composite-composite single-lap joints using chirped FBG sensors

机译:使用chi FBG传感器检测复合材料单搭接接头的胶结生长

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Adhesively bonded composite-composite single-lap joints, with cross-ply GFRP adherends, have been cyclically loaded to initiate disbonding at either end of the overlap length. Disbond initiation and growth have been monitored using a combination of in situ photography (the joint is transparent) and a single chirped fibre Bragg grating (CFBG) sensor embedded within one composite adherend (with the low-wavelength end of the sensor adjacent to the cut end) and not in the adhesive bondline. Sensors having the same spectral bandwidth (20 nm) and lengths in the range 15-60 mm have been tested. The experimental results have been modelled using a combination of finite-element analysis and commercial software for predicting FBG spectra, and the predictions are in very good agreement with the experimental results. In all cases, it has been shown that the position of the disbond front can be located using the CFBG sensors with a precision of about 2 mm.
机译:带有交叉GFRP被粘物的粘合复合材料复合材料单搭接接头已循环加载,以在搭接长度的任一端开始剥离。已经结合使用原位照相(接头透明)和嵌入一个复合被粘物中的单个fiber光纤布拉格光栅(CFBG)传感器(传感器的低波长端与切口相邻)的组合来监测脱胶的起始和生长末端),而不是在粘合剂粘结线中。已经测试了具有相同光谱带宽(20 nm)和长度在15-60 mm范围内的传感器。利用有限元分析和商业软件相结合对实验结果进行了建模,以预测FBG光谱,并且该预测与实验结果非常吻合。在所有情况下,已经表明,可以使用CFBG传感器以约2 mm的精度定位脱胶前端的位置。

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