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Dense graphene foam and hexagonal boron nitride filled PDMS composites with high thermal conductivity and breakdown strength

机译:具有高导热性和击穿强度的致密石墨烯泡沫和六方氮化硼填充的PDMS复合材料

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In the present study, high thermally conductive and electrically insulated polymer composites containing modified dense graphene foam (MGF) and modified hexagonal boron nitride (M-h-BN) via polydopamine (PDA) coating and 3-aminopropyltriethoxysilane (APTS) grafting were manufactured and studied. Due to the double percolated networks built by MGF and M-h-BN, the polydimethylsiloxane (PDMS) matrix composite has high thermal conductivity of 23.45Wm(-1)K(-1) and 2.11Wm(-1)K(-1) in in-plane and out-of-plane directions, respectively. In addition, an insulated layer of M-h-BN/PDMS can be introduced onto both sides of composite sample with the help of infiltration technique, which results in a high breakdown strength of 4.5 kV/mm. Owing to the excellent comprehensive properties, the M-h-BN/MGF/PDMS composite has a promising application in heat management field of the microelectronic industry. (C) 2017 Elsevier Ltd. All rights reserved.
机译:在本研究中,通过聚多巴胺(PDA)涂层和3-氨基丙基三乙氧基硅烷(APTS)接枝制备了包含改性致密石墨烯泡沫(MGF)和改性六方氮化硼(M-h-BN)的高导热和电绝缘聚合物复合材料。由于由MGF和Mh-BN构建的双重渗透网络,聚二甲基硅氧烷(PDMS)基质复合材料在室温下具有23.45Wm(-1)K(-1)和2.11Wm(-1)K(-1)的高热导率。平面内和平面外方向。此外,借助渗透技术,可以将M-h-BN / PDMS绝缘层引入复合样品的两侧,从而获得4.5 kV / mm的高击穿强度。由于其优异的综合性能,M-h-BN / MGF / PDMS复合材料在微电子行业的热管理领域具有广阔的应用前景。 (C)2017 Elsevier Ltd.保留所有权利。

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