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Consideration of spatial variation of the length scale parameter in static and dynamic analyses of functionally graded annular and circular micro-plates

机译:在功能梯度环形和圆形微板的静态和动态分析中考虑长度比例参数的空间变化

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摘要

This article introduces new methods for static and free vibration analyses of functionally graded annular and circular micro-plates, which can take into account spatial variation of the length scale parameter. The underlying higher order continuum theory behind the proposed approaches is the modified couple stress theory. A unified way of expressing the displacement field is adopted so as to produce numerical results for three different plate theories, which are Kirchhoff plate theory (KPT), Mindlin plate theory (MPT), and third-order shear deformation theory (TSDT). Governing partial differential equations and corresponding boundary conditions are obtained following the variational approach and the Hamilton's principle. Derived systems of differential equations are solved numerically by utilizing the differential quadrature method (DQM). Comparisons to the results available in the literature demonstrate the high level of accuracy of the numerical results generated through the developed methods. Extensive analyses are presented in order to illustrate the influences of various geometric and material parameters upon static deformation profiles, stresses, and natural vibration frequencies. In particular, the length scale parameter ratio -which defines the length scale parameter variation profile-is shown to possess a profound impact on both static and dynamic behaviors of functionally graded annular and circular micro-plates. (C) 2015 Elsevier Ltd. All rights reserved.
机译:本文介绍了功能梯度环形和圆形微板静态和自由振动分析的新方法,该方法可以考虑长度比例参数的空间变化。所提出的方法背后的基本高阶连续体理论是修正偶应力理论。采用统一的位移场表示方法,以产生三种不同板理论的数值结果,分别是基尔霍夫板理论(KPT),敏德林板理论(MPT)和三阶剪切变形理论(TSDT)。遵循变分法和汉密尔顿原理,获得了支配的偏微分方程和相应的边界条件。利用微分求积法(DQM)对微分方程的派生系统进行数值求解。与文献中可用结果的比较表明,通过开发的方法生成的数值结果具有很高的准确性。为了说明各种几何和材料参数对静态变形轮廓,应力和固有振动频率的影响,进行了广泛的分析。特别地,示出了长度尺度参数比(其定义了长度尺度参数变化曲线)对功能梯度的环形和圆形微板的静态和动态行为均具有深远的影响。 (C)2015 Elsevier Ltd.保留所有权利。

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