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Control System Design for Height Measurement of BGA Balls Based on Timed Automata

机译:基于定时自动机的BGA球测高控制系统设计

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This paper presents a model, based on timed automata (TA), of a real-time control system to measure the heights of solder balls of ball grid arrays (BGAs) on a printed circuit board and to determine whether the BGAs pass the height inspection routine. The TA model is actually a network of five TA, namely User, Controller, Motion, Camera, and Light, synchronized through user-defined channels. The dynamics of system components are simplified by a time delay which can be determined through experiments or roughly by experience. The simulation and verification in UPPAAL show that the model works fine without deadlock, and procedures after user operations demonstrate proper timely cooperation among the automata. The main design of hardware and software for the control system based on the model is also given in this paper, which has been successfully implemented in our laboratory.
机译:本文提出了一种基于定时自动机(TA)的实时控制系统模型,该模型可以测量印刷电路板上的球栅阵列(BGA)焊球的高度,并确定BGA是否通过了高度检查常规。 TA模型实际上是通过用户定义的通道同步的五个TA的网络,即用户,控制器,运动,摄像机和灯光。通过延时可以简化系统组件的动态,延时可以通过实验确定,也可以根据经验确定。 UPPAAL中的仿真和验证表明,该模型可以在没有死锁的情况下正常运行,并且用户操作后的过程表明自动机之间可以适当地及时协作。本文还给出了基于该模型的控制系统的硬件和软件的主要设计,并已在本实验室成功实现。

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