Alternating Current Electrothermal Flow for Cooling of Localized Hot Spots in Microelectronic Devices

摘要

In this article, we present our results on an energy-efficient cooling technology for localized microprocessor hot spots using alternating current electrothermal (ACET) flows. The electrothermal process deploys an electrokinetic transport mechanism without requiring any external prime mover and can be shown to be highly effective in reducing hot spot temperatures below their allowable limits. The proposed technique leverages the heat source(s) itself to drive the fluid in the electrothermal cooling mechanism, thereby making it efficient. Our parametric analyses present the optimal range of fluid properties, namely, electrical conductivity, where the cooling effectiveness is maximum. Furthermore, the impact of geometrical parameters as well as input voltages has been characterized. These results establish the potential of the electrothermal cooling and can open up a new avenue to be explored for thermal management of miniaturized devices and systems.