UMC BREAKS GROUND ON A NEW 12-INCH WAFER FABRICATION FACILITY IN TAIWAN

摘要

Taiwanese semiconductor foundry United Microelectronics Corporation (UMC) held a groundbreaking ceremony in March for its new FAB in Tainan, intended to produce 12-inch (300mm) silicon wafers. Speaking at the company's recent annual trading review, Po-Wen Yen, CEO of UMC, said the company expects the building structure to be completed and the FAB cleanroom to be ready for equipment move-in by Q2 2016, with initial production scheduled for late 2016.