Non-Intrusive Online Distributed Pulse Shrinking-Based Interconnect Testing in 2.5D IC

摘要

In this brief, a non-invasive online solution for 2.5D IC based on distributed pulse shrinking is proposed to test the faults of interconnects. Furthermore, a regression model based on artificial neural network (ANN) is proposed in order to judge whether the interconnects are faulty and quantify the degree of the faults in real time by online monitoring the delay of interconnects. Experiments on defect detection are presented through HSPICE simulation with realistic models for 45nm CMOS technology. The results show that the proposed method has features including: high resolution, low area overhead, high robustness, and be able to predict the class and the fault size.