首页> 外文期刊>Circuits and Systems II: Express Briefs, IEEE Transactions on >An Advanced Bootstrap Circuit for High Frequency, High Area-Efficiency and Low EMI Buck Converter
【24h】

An Advanced Bootstrap Circuit for High Frequency, High Area-Efficiency and Low EMI Buck Converter

机译:用于高频,高效率和低EMI降压转换器的高级自举电路

获取原文
获取原文并翻译 | 示例
           

摘要

An advanced bootstrap control circuit with directly sensing bootstrap voltage (DSBV) for a high frequency, high area-efficiency, and low electromagnetic interference (EMI) buck converter in automotive applications is proposed in this brief. By removing the large off-chip capacitor at the output V-CC of low-dropout regulator (LDO), the relevant current loop around V-CC to power ground can be eliminated, which is a great contribution for EMI noise mitigation. On the other hand, the fast charging control for bootstrap capacitance has been substituted by a novel bootstrap architecture and is not dependent on the internal capless LDO, which will not degrade high-frequency behavior for the high-side gate driver. This buck converter has been implemented in a 0.35 mu m high-voltage BCD process and occupies a chip area of 2x2.39 mm(2), where the active area of bootstrap circuit is 320x194 mu m(2). Experimental results show that the bootstrap capacitance can be fully charged at MHz switching frequency with a small quiescent current of 43 mu A.
机译:简要介绍了一种可直接检测自举电压(DSBV)的高级自举控制电路,该电路用于汽车应用中的高频,高面积效率和低电磁干扰(EMI)降压转换器。通过在低压差稳压器(LDO)的输出V-CC处移除大的片外电容器,可以消除V-CC周围与电源地之间的相关电流环路,这对减轻EMI噪声做出了巨大贡献。另一方面,用于自举电容的快速充电控制已被新颖的自举架构所取代,并且不依赖于内部无电容LDO,这不会降低高端栅极驱动器的高频性能。该降压转换器已通过0.35μm的高压BCD工艺实现,占用的芯片面积为2x2.39 mm(2),其中自举电路的有效面积为320x194μm(2)。实验结果表明,自举电容可以在MHz开关频率下以43μA的小静态电流完全充电。

著录项

  • 来源
  • 作者单位

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Automotive electronics; low EMI; high frequency; high voltage; bootstrap circuit; buck converter;

    机译:汽车电子;低EMI;高频;高电压;自举电路;降压转换器;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号