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MOVING EMBEDDED PASSIVES FROM THE LAB TO THE FAB

机译:将嵌入式被动从实验室移至FAB

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摘要

What if you had to start putting integrated passives in your circuit boards today? What sorts of materials and processes do you have to choose from? Integrated passives for organic substrates are coming, not quickly and not all at once, but they will get here. We're all familiar with the various hurdles to implementing them: lack of design tools, an immature supply chain, uncertainty on cost effectiveness, questions over the best processes, yield issues, tolerance issues and required changes in business models. Covering all of these in any detail would require at least several issues of CircuiTree. In this article, I want to take the viewpoint of a company that manufactures circuit boards which, for whatever reason, wants to implement an integrated passive capability today. What options are available and how might they fit with a company's current capabilities?
机译:如果您今天必须开始在电路板上放置集成无源元件怎么办?您必须选择哪种材料和工艺?用于有机基板的集成无源器件正在迅速,并非一次性地出现,但很快就会到来。我们都熟悉实现它们的各种障碍:缺少设计工具,不成熟的供应链,成本效益的不确定性,最佳流程的问题,良率问题,容忍度问题以及业务模型的必要更改。要涵盖所有这些细节,至少需要发行几本CircuiTree。在本文中,我想从一家制造电路板的公司的观点出发,无论出于何种原因,该公司现在都希望实现集成的无源功能。有哪些可用选项,它们将如何适应公司的现有功能?

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