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Fine Lines in High Yield (Part CVⅢ): Novel Fluid Movement and Drying Techniques

机译:高产细线(CVⅢ部分):新的流体移动和干燥技术

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摘要

PWB fabricators have relied for decades on conventional fluid movement techniques in wet processing such as spraying, air sparging, knife-edge and paddle agitation. Improved fluid dynamics were then needed to process boards with high aspect ratio through-holes and blind vias. An improved rinsing technique was introduced by IBM in the form of the Fluid Head~(TM) design (see also under "Drying"). Better through-hole and blind via fluid dynamics were achieved by "eductors," fluid "push/pull" devices such as flood bars and vacuum extraction, and ultra-sound assisted designs.
机译:PWB制造商数十年来一直在湿法加工中使用传统的流体移动技术,例如喷涂,空气喷射,刀口和桨叶搅拌。然后需要改善流体动力学,以处理具有高深宽比通孔和盲孔的电路板。 IBM以Fluid Head〜(TM)设计的形式引入了一种改进的漂洗技术(另请参见“干燥”下)。通过“喷射器”,流体“推/拉”装置(例如溢流杆和真空抽气)以及超音速辅助设计,可以实现更好的通孔和盲孔流体动力学。

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