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Fine Lines in High Yield (Part CV): Laser Direct Imaging Update

机译:高产量的细线(CV部分):激光直接成像更新

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摘要

During the past year PWB fabricators have shown a renewed interest in LDI after about two years of relative dormancy. It appears that there are several drivers for this development. The growing need for: "true position" imaging of small features over large formats, improved layer-to-layer registration, the "scaling" of an image (i.e., changing the image dimensions and/or shifting the image for best-fit registration to a shifted or distorted reference image), and lower cost of ownership for an LDI system. These needs are now met through improved capabilities of the LDI imager, longer life and lower power consumption of solid state lasers, and advanced photoresists for primary imaging as well as soldermasks with reasonable photospeed. Evidence for the growing acceptance of LDI beyond quick-turn, small lot applications is Tyco's investment in multiple LDI imagers to enable them to process difficult jobs at reasonable yields.
机译:在过去的一年中,PWB制造商在经历了大约两年的相对休眠之后,对LDI表现出了新的兴趣。似乎有几个驱动程序可以用于此开发。不断增长的需求:对大尺寸的小特征进行“真实位置”成像,改进的逐层配准,图像的“缩放”(即,更改图像尺寸和/或移动图像以实现最佳拟合配准)到偏移或扭曲的参考图像),并降低了LDI系统的拥有成本。现在,通过改进LDI成像仪的功能,延长使用寿命和降低固态激光器的功耗以及用于初级成像的高级光刻胶以及具有合理光速的阻焊剂,可以满足这些需求。泰科(Tyco)对多台LDI成像仪的投资使他们能够以合理的产量处理困难的工作,这证明了LDI在快速转向小批量应用之外得到越来越多的接受。

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