Ready for MID?

摘要

Some may recall the 3D Circuits initiative of the 1980s. Proponents hoped that molded circuits would gamer a nice chunk of the printed circuit market. Plastic molding, combined with any number of conductor-generating processes, was used to produce both 2D and 3D shaped circuits. These products could serve as a platform for components and provide electrical interconnects. The basic concept was a good idea twenty years ago and makes even more sense today. But molded circuits failed to capture all but a tiny market niche. Today, the molded circuit idea is here as Molded Interconnect Devices (MID). But is the timing and technology right for a comeback? I think so, and here's why.