Controlling Impedance Down to the Chip

摘要

High-speed electronic signal circuits place significant demands on the circuits and interconnections employed in their point-to-point transmission. This is becoming increasingly important as signal speeds enter the multi-gigahertz range. The challenge begins at the chip. From there the problems cascade through the entire electronic interconnection chain. Ultimately, the transmission of electronic signals of unchanging impedance is critical to the performance of advanced systems. This being so, interconnecting devices and structures that provide such capability are vitally important to the production of viable electronic products. Unfortunately, properly controlling the characteristic impedance, while changing the feature sizes and spacing of the conductors, is challenging.